Methodological Framework thiab txheej txheem xaiv
• Txhais cov hom phiaj ua haujlwm thiab qhov txwv: suav nrog qhov tseeb, qhov zoo ntawm qhov chaw, cov khoom siv kho tshuab, qhov loj thiab cov khoom loj, cov khoom siv thiab cov nqi, lub voj voog xa khoom, thiab lwm yam, txhawm rau txiav txim siab txog txoj hauv kev thiab cov khoom siv.
• Cov txheej txheem tseem ceeb thiab cov ntsiab lus hloov kho (kom nkag siab raws li ASTM kev faib tawm):
• Khoom siv Extrusion (FDM/FFF): Filament extrusion, tus nqi qis, siv tau yooj yim, tsim nyog rau kev kuaj xyuas tus qauv thiab kev ua haujlwm zoo; rhiab heev rau sag thiab nto kev ntxhib los mos.
• Txo Photopolymerization (SLA/DLP/LCD): Ua kua resin curing, siab daws teeb meem, du nto, haum rau precision qhov chaw thiab me me pwm masters.
• Powder Bed Fusion (SLS/SLM/EBM): Laser/electron beam melting ntawm hmoov, siab zog, ib-txheej molding ntawm complex sab hauv kab noj hniav, haum rau haumxeeb qhov chaw thiab hlau qhov chaw.
• Binder Jetting: hmoov + binder, nrawm tsim, txhawb xim thiab ntau yam ntaub ntawv, feem ntau ua ke nrog sintering / impregnation los txhim kho lub zog. • Directed Energy Deposition (DED/LC/LENS): Coaxial feeding of filament/healthy, haum rau additive kho thiab remanufacturing, thiab gradient cov ntaub ntawv.
• Sheet Lamination (LOM/UAM): Sheet stacking and bonding/ultrasonic consolidation, tsim nyog rau qhov zoo li loj thiab qis - nqi sai prototyping.
• Cov lus pom zoo sib tw nrawm:
• Rau ultra- siab precision / du nto: SLA / DLP nyiam;
• Rau cov qauv muaj zog / hlau qhov chaw: SLM / EBM lossis DED nyiam;
• Rau tus nqi -effectiveness/sapid iteration: FDM nyiam;
• Rau qhov loj loj / xim / xuab zeb pwm: Xav txog kev sib tw sib tw.
Cov txheej txheem saum toj no hauv tsev neeg, ntws, thiab qhov kev thov ntawm txhua tus ua raws li cov qauv kev faib tawm thiab kev coj ua ntawm kev tsim khoom ntxiv.
